Google Pixel 10 to pack powerful TSMC-made Tensor G5 chip
Google is partnering with Taiwan Semiconductor Manufacturing Company (TSMC) to develop the Tensor G5 chip, according to Android Authority. This significant shift from Samsung foundry to TSMC is a part of Google's ongoing work on the Pixel 10. Reports from last year indicated that Google had aimed to launch its first fully customized chip in 2024, but faced delays even after reducing features.
Google's "Laguna" chip set for 2025 release
Google has now shifted its focus to 2025 for the release of the chip codenamed "Laguna," continuing its tradition of beach-themed codenames. The Tensor G5 is expected to be based on TSMC's 3-nanometer manufacturing process and is anticipated to utilize Integrated Fan-Out (InFO) technology to enhance power efficiency and reduce thickness. Android Authority has shared a trade database entry that confirms the involvement of TSMC and InFO_PoP in the chip's development.
Delays push new chip debut to next year
TSMC describes InFO_PoP as the industry's first 3D wafer level fan-out package, offering superior electrical and thermal performances than FC_PoP, due to its lack of organic substrate and C4 bump. If development had proceeded as planned, these new chips would have debuted alongside the Pixel 9's new design language. However, delays mean that this year's phone lineup, the Pixel 9 series, will feature the Tensor G4 chip - a minor upgrade still manufactured by Samsung.
G4 SoC reportedly supports 16GB of RAM
The entry for the early chip revision also includes 16GB of RAM from SEC (Samsung Electronics Co), similar to the Pixel 9 Pro. This increased RAM is necessary to support on-device AI capabilities like Gemini Nano and its upcoming multimodal features.
